logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11410906 B1

PDFFull Text
Date of Patent:
Aug. 09, 2022

Filed:

Jun. 10, 2020

Semiconductor package and method for fabricating a semiconductor package

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Juergen Hoegerl, Regensburg, DE;

Bernd Betz, Obertraubling / Oberhinkofen, DE;

Stephan Bradl, Regensburg, DE;

Daniel Obermeier, Ensdorf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Jasmine J Clark

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 23/5386 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/83815 (2013.01);
Abstract

A semiconductor package for double sided cooling includes a first and a second carrier facing each other, at least one power semiconductor chip arranged between the first and second carriers, external contacts arranged at least partially between the first and second carriers, and spring elements arranged between the first and second carriers and configured to keep the first and second carriers at a predefined distance from each other.

Find Patent Forward Citations

Hoegerl, Juergen. (2022). Semiconductor package and method for fabricating a semiconductor package (U.S. Patent No. 11410906). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11410906

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…