This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2006
Title: The Innovations of Daniel Lee
Introduction
Daniel Lee is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the development of advanced packaging technologies. His work has been instrumental in enhancing the performance and reliability of microelectronic devices.
Latest Patents
One of Daniel Lee's key patents is titled "Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA)." This innovative microelectronic package comprises a device substrate with first and second opposing surfaces, which houses a plurality of microelectronic devices. The package also includes several electrically conductive members that are coupled to the corresponding microelectronic devices and extend away from the first surface. A thermally conductive layer is positioned on the second surface of the device substrate, while a package substrate is coupled to the device substrate, featuring a plurality of electrically conductive traces linked to the conductive members. This patent showcases his expertise in improving thermal management in microelectronic packaging.
Career Highlights
Daniel Lee is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., where he continues to innovate and contribute to the field of semiconductor technology. His work has led to advancements that enhance the efficiency and performance of microelectronic devices.
Collaborations
Throughout his career, Daniel has collaborated with talented individuals such as Chender Huang and Chien-Hsiun Lee. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Daniel Lee's contributions to microelectronics, particularly through his patent on thermal dispensing enhancement, highlight his role as a leading inventor in the industry. His work continues to influence the development of high-performance microelectronic packages, showcasing the importance of innovation in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile