Daniel J Hubbard

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel J Hubbard. Retrieved from https://idiyas.com/inventor/daniel-j-hubbard-xy9c1br3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Daniel J. Hubbard and Patent Innovation

Introduction

Daniel J. Hubbard is an inventor associated with Micron Technology Incorporated. His listed patent concerns organizing reclaim units according to endurance capability.

Latest Patents

Hubbard is credited with 1 patent: “Reclaim Unit Organization by Endurance Capability.” The patent’s title describes an approach to arranging reclaim units based on their endurance characteristics.

Career Highlights

Hubbard’s recorded patent activity connects his work with Micron Technology Incorporated and focuses on reclaim-unit organization. The available information does not specify his role, location, or the patent’s filing and grant dates.

Collaborations

Hubbard is listed as a coworker of Sampath Ratnam. The provided information does not describe the details of their collaboration.

Conclusion

Daniel J. Hubbard’s listed patent reflects an innovation in organizing reclaim units by endurance capability and is associated with Micron Technology Incorporated.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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