Daniel Hao-Tien Lee

Title: Innovations by Inventor Daniel Hao-Tien Lee

Introduction

Daniel Hao-Tien Lee is a prominent inventor based in Hsinchu, Taiwan. With a portfolio of seven patents, he has significantly contributed to the field of semiconductor technology. His work primarily focuses on methods for enhancing integrated circuit fabrication processes, where precision and efficiency are crucial.

Latest Patents

Among his latest innovations is a patent on "UV resist curing as an indirect means to increase SiN corner selectivity." This method outlines a technique for forming a self-aligned contact in integrated circuit fabrication. The process involves creating semiconductor device structures atop a substrate, covered by a silicon nitride layer. By depositing a silicon oxide layer and utilizing photoresist exposed to ultraviolet light, Lee's method allows for high-temperature etching, optimizing the selectivity of the silicon nitride layer.

Furthermore, Lee has developed a "two-step etching process for forming self-aligned contacts." This innovation is particularly valuable in the production of DRAMs, where forming precise bitline contacts is critical. The invention overcomes challenges associated with polymer formations during etching, ensuring that the contact openings remain clear and functionally effective, thereby enhancing manufacturing reliability in high-density environments.

Career Highlights

During his career, Daniel Hao-Tien Lee has worked with notable organizations such as Vanguard International Semiconductor Corporation and the Industrial Technology Research Institute. His roles at these institutions have allowed him to hone his expertise in semiconductor engineering and etching techniques, which are pivotal in modern electronics.

Collaborations

Lee has collaborated with several skilled professionals throughout his career, including Bi-Ling Chen and Erik S. Jerry. These partnerships have facilitated the exchange of ideas and methodologies, leading to groundbreaking advancements in semiconductor manufacturing.

Conclusion

Daniel Hao-Tien Lee stands as a leading innovator in the semiconductor field. His seven patents reflect his commitment to enhancing integrated circuit fabrication methods. As technology continues to evolve, Lee's contributions will undoubtedly play a critical role in shaping the future of semiconductor technology.