The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Mar. 10, 1997
Applicant:
Inventors:
Gwo-Yuh Shiau, Hsinchu, TW;
Shinn-Jhy Lian, Lyu-Ying, TW;
Daniel Hao-Tien Lee, Hsinchu, TW;
Li-Ming Wang, Chechang-Shiang, TW;
Hsiang-Wei Tseng, Taichung, TW;
Assignee:
Vanguard International Semiconductor, Hsin-chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ; H01L / ;
U.S. Cl.
CPC ...
427240 ; 427314 ; 4274071 ; 427337 ; 427384 ; 438761 ; 438782 ;
Abstract
A method for providing a uniform coating of photoresist over substrate for defining high density integrated device and circuit patterns. This is accomplished by applying the photoresist onto the substrate in multiple, separate dispensing steps and leveling spins to attain the designed thickness uniformly over substrate having high topographic surfaces, thereby preserve the integrity of the critical dimension for multi-level alignments used in the fabrication of integrated devices and circuits.