Phoenix, AZ, United States of America

Daniel Dragoon


Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 85(Granted Patents)


Company Filing History:


Years Active: 2003-2004

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3 patents (USPTO):Explore Patents

Title: Innovations of Daniel Dragoon

Introduction

Daniel Dragoon is an accomplished inventor based in Phoenix, Arizona. He has made significant contributions to the field of thermal energy management through his innovative designs and patents. With a total of three patents to his name, Dragoon's work primarily focuses on heat transfer apparatuses that enhance the efficiency of heat dissipation in electrical devices.

Latest Patents

One of Dragoon's latest patents is a heat transfer apparatus designed to improve the spreading and dissipation of thermal energy from heat-producing components. This invention includes various embodiments, such as a spring-biased member that can be attached to a heat-producing device. Another embodiment features a spring-biased carrier that supports a finned plate for enhanced heat dissipation. Additionally, Dragoon's patent includes a spring-biased member with fingers that conduct thermal energy to a structure, as well as a clip that attaches separate heat-spreading members against a heat-producing component.

Career Highlights

Daniel Dragoon is currently employed at Intel Corporation, where he applies his expertise in thermal management technologies. His work at Intel has allowed him to contribute to the development of advanced electronic devices that require efficient heat management solutions.

Collaborations

Throughout his career, Dragoon has collaborated with notable colleagues, including Mark D. Summers and Javier Leija. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Daniel Dragoon's contributions to the field of thermal energy management through his patents and work at Intel Corporation highlight his role as a significant inventor. His innovative designs continue to influence the efficiency of heat dissipation in electronic devices.

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