Newark, CA, United States of America

Daniel Byun

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Lam Research Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Byun. Retrieved from https://idiyas.com/inventor/daniel-byun-k0kxog5u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Daniel Byun

Introduction

Daniel Byun is a notable inventor based in Newark, California. He has made significant contributions to the field of plasma technology, particularly in optimizing processes related to substrate handling in semiconductor manufacturing.

Latest Patents

Daniel Byun holds a patent titled "Methods and arrangement for plasma dechuck optimization based on coupling of plasma signaling to substrate position and potential." This innovative method focuses on optimizing a dechuck sequence, which involves the removal of a substrate from a lower electrode. The process includes performing an initial analysis to determine if a first set of electrical characteristic data of a plasma formed during the dechuck sequence traverses threshold values. If the threshold is crossed, the inert gas is turned off. The method also involves slightly raising the lifter pins from the lower electrode to move the substrate upward. Additionally, a mechanical and electrical analysis is performed, comparing the force exerted by the lifter pins against a threshold value. If both the mechanical and electrical data meet their respective thresholds, the substrate is removed from the lower electrode, indicating a successful substrate-released event.

Career Highlights

Daniel Byun is currently employed at Lam Research Corporation, a leading company in the semiconductor equipment industry. His work focuses on enhancing the efficiency and effectiveness of plasma processes, which are critical in the manufacturing of integrated circuits.

Collaborations

Throughout his career, Daniel has collaborated with esteemed colleagues, including John C Valcore, Jr. and Saurabh J Ullal. These collaborations have contributed to the advancement of technologies in the semiconductor field.

Conclusion

Daniel Byun's innovative work in plasma technology and his patent contributions highlight his role as a significant inventor in the semiconductor industry. His efforts continue to influence advancements in manufacturing processes, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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