Dandan Shi

Title: Dandan Shi: Innovator in Wafer Warpage Control

Introduction

Dandan Shi is a notable inventor based in Wuhan, China. She has made significant contributions to the field of semiconductor technology, particularly in the area of wafer warpage control. Her innovative methods have the potential to enhance the manufacturing processes in the semiconductor industry.

Latest Patents

Dandan Shi holds a patent for "Methods for Wafer Warpage Control." This patent outlines a method that includes forming a filling structure in a slit opening on a wafer. The process involves measuring a warpage parameter of the wafer and determining a thermal profile to adjust the warpage parameter into a target range. The method culminates in performing a process with the determined thermal profile to achieve the desired warpage control.

Career Highlights

Dandan Shi is currently employed at Yangtze Memory Technologies Co., Ltd. Her work at this leading technology company has allowed her to focus on innovative solutions that address critical challenges in semiconductor manufacturing. With her expertise, she has contributed to advancements that improve product quality and efficiency.

Collaborations

Dandan has collaborated with talented individuals such as Ming Hu and Shijin Luo. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Dandan Shi's contributions to wafer warpage control exemplify her commitment to innovation in the semiconductor industry. Her work not only enhances manufacturing processes but also sets a foundation for future advancements in technology.