Company Filing History:
Years Active: 2023-2024
Title: Dandan Lyu - Innovator in Solder Joint Reliability
Introduction
Dandan Lyu is a prominent inventor based in Dublin, CA, specializing in the field of electronic product reliability. With a focus on solder joint reliability, Lyu has made significant contributions to the engineering community through innovative patent applications. He holds a total of 2 patents that showcase his expertise and dedication to advancing technology.
Latest Patents
Lyu's latest patents include systems and methods of simulating drop shock reliability of solder joints with a multi-scale model. This invention involves a global computer-aided engineering (CAE) model that represents an electronic product containing solder joints. The detailed solder joint model includes components such as solder balls, metal pads, printed circuit boards, and semiconductor chip portions. The global CAE model identifies locations of solder joints for evaluation in drop test simulations. By replicating the solder joint model at each location, a local CAE model is created, allowing for a comprehensive analysis of the product's physical behaviors under design conditions. This co-simulation approach synchronizes simulated behaviors based on kinematic and force constraints, enhancing the reliability assessment of solder joints.
Career Highlights
Dandan Lyu is currently employed at Ansys, Inc., a leading company in engineering simulation software. His work at Ansys has allowed him to apply his innovative ideas in practical applications, contributing to the development of advanced engineering solutions.
Collaborations
Lyu collaborates with talented professionals in his field, including Cheng-Tang Wu and Wei Hu. These collaborations foster a creative environment that enhances the development of innovative solutions in solder joint reliability.
Conclusion
Dandan Lyu's contributions to the field of solder joint reliability through his patents and work at Ansys, Inc. highlight his role as an influential inventor. His innovative approaches continue to shape the future of electronic product reliability.