The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11720726 B1

Date of Patent:

Aug. 08, 2023

Filed:

Oct. 29, 2020

Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model

Applicant:

Ansys, Inc., Canonsburg, PA (US);

Inventors:

Cheng-Tang Wu, Livermore, CA (US);

Wei Hu, Mountain View, CA (US);

Dandan Lyu, Dublin, CA (US);

Siddharth Shah, Irvine, CA (US);

Ashutosh Srivastava, Mountain View, CA (US);

Assignee:

ANSYS Inc., Canonsburg, PA (US);

Attorney:

Primary Examiner:

Kibrom K Gebresilassie

Int. Cl.

CPC ...

G06F 30/20 (2020.01); G06F 119/02 (2020.01); G06F 115/12 (2020.01); G06F 111/04 (2020.01); G06F 30/25 (2020.01); G06F 119/22 (2020.01); G06F 30/28 (2020.01); G06F 111/00 (2020.01);

U.S. Cl.

CPC ...

G06F 30/20 (2020.01); G06F 30/25 (2020.01); G06F 30/28 (2020.01); G06F 2111/00 (2020.01); G06F 2111/04 (2020.01); G06F 2115/12 (2020.01); G06F 2119/02 (2020.01); G06F 2119/22 (2020.01);

Abstract

A global computer aided engineering (CAE) model representing an electronic product that contains solder joints and an individual detailed solder joint model are received. The solder joint model can include a solder ball, one or more metal pads, a portion of printed circuit board, and a portion of semiconductor chip component. The global CAE model includes locations of the solder joints to be evaluated in a drop test simulation. The solder joint model is replicated at each location to create a local CAE model via a geometric relationship between the global CAE model and the local CAE model. Simulated physical behaviors of the product under a design condition are obtained in a co-simulation using the global CAE model in a first time scale and the local CAE model in a second time scale. Simulated physical behaviors are periodically synchronized based on kinematic and force constraints.

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