Company Filing History:
Years Active: 2014
Title: Dan Wang - Innovator in Substrate Processing Technology
Introduction
Dan Wang is a notable inventor based in Saratoga, CA (US). He has made significant contributions to the field of substrate processing, particularly through his innovative patent. His work focuses on enhancing the efficiency and accuracy of material deposition on substrates.
Latest Patents
Dan Wang holds a patent titled "Substrate processing including correction for deposition location." This patent describes a combinatorial processing chamber that incorporates a correction mechanism for deposition locations. The chamber allows for the processing of multiple regions of a substrate using different parameters. For instance, one area can have one material deposited while another area can have a different material, showcasing the versatility of the technology. The chamber employs a rotating and revolving substrate pedestal to ensure uniform deposition across all locations. Additionally, it utilizes a correction factor to account for variations in alignment and configuration, ensuring that the actual deposition location closely matches the desired location.
Career Highlights
Dan Wang is currently employed at Intermolecular, Inc., where he continues to develop and refine his innovative technologies. His work has positioned him as a key player in the field of substrate processing, contributing to advancements that benefit various industries.
Collaborations
Dan collaborates with talented individuals such as Jeremy Cheng and Ho Yin Owen Fong, who contribute to the innovative environment at Intermolecular, Inc. Their combined expertise fosters a culture of creativity and technological advancement.
Conclusion
Dan Wang's contributions to substrate processing technology through his patent demonstrate his commitment to innovation. His work not only enhances material deposition techniques but also paves the way for future advancements in the field.