Dan Okamoto

This inventor holds 6 USPTO granted patents and 7 published patent applications. Top assignee: Texas Instruments Corporation. Active years: 2010-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dan Okamoto. Retrieved from https://idiyas.com/inventor/dan-okamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 (Patent Applications = 7)

% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 5(Granted Patents)

Company Filing History:

6 out of 29,901

Texas Instruments Corporation

patents

Years Active: 2010-2023

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11735435 - Quad flat no lead package and method of making (2023-08-22),

2. 10665475 - Quad flat no lead package and method of making (2020-05-26),

3. 9536753 - Circuit substrate interconnect (2017-01-03),

4. 9379087 - Method of making a QFN package (2016-06-28),

5. 8465619 - Semiconductor die collet (2013-06-18),

6. 7790507 - Semiconductor die collet and method (2010-09-07),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

7 patents pending: