The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Jun. 11, 2014
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Dan Okamoto, Oita, JP;

Hiroyuki Sada, Oita, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 23/3157 (2013.01); H01L 23/49541 (2013.01); H01L 23/49861 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 23/5389 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18165 (2013.01);
Abstract

A quad flat no lead ('QFN') package that includes a die having an active side positioned substantially in a first plane and a backside positioned substantially in a second plane parallel to the first plane; a plurality of separate conductive pads each having a first side positioned substantially in the first plane and a second side positioned substantially in the second plane; and mold compound positioned between the first and second planes in voids between the conductive pads and the dies. Also a method of producing a plurality of QFN packages includes forming a strip of plastic material having embedded therein a plurality of dies and a plurality of conductive pads that are wire bonded to the dies and singulating the strip into a plurality of QFN packages by cutting through only the plastic material.


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