This inventor holds 2 USPTO granted patents. Top assignees: Burroughs, Inc., Unisys Corporation. Active years: 1987-1990.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1987-1990
Title: The Innovative Contributions of Dale L Robinson
Introduction
Dale L Robinson is a notable inventor based in Escondido, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on methods and apparatuses that enhance the reliability and functionality of electronic components.
Latest Patents
Robinson's latest patents include a method and apparatus for detecting leaks in integrated circuit (IC) packages. This innovative method involves filling the enclosure with a first gas when sealing it, followed by enveloping the package with a second, different gas. The process includes holding the second gas at a constant pressure and sensing the enclosure's surface for microscopic deflections. This technique allows for the detection of both gross and minor leaks, providing a reliable means of ensuring the integrity of IC packages. Another significant patent is for a magnetically sealed multichip integrated circuit package. This design features a substrate with a cavity for multiple integrated circuit dies, protected by a lid that is held in place by a ferromagnetic seal ring and a corresponding magnet. This innovative approach enhances the protection of sensitive electronic components.
Career Highlights
Throughout his career, Robinson has worked with prominent companies such as Unisys Corporation and Burroughs, Inc. His experience in these organizations has contributed to his expertise in the field of electronics and integrated circuit design.
Collaborations
Robinson has collaborated with notable coworkers, including Wilbur T Layton and Jerry Ihor Tustaniwskyj. These partnerships have likely enriched his work and led to further advancements in his inventions.
Conclusion
Dale L Robinson's contributions to the field of integrated circuit packaging are noteworthy. His innovative patents demonstrate a commitment to enhancing the reliability of electronic components. His career reflects a dedication to advancing technology through practical solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile