Unisys Corporation

Burroughs, Inc.

Dale L Robinson

Jerry Ihor Tustaniwskyj

Wilbur T Layton

John A Nelson

A leak in an enclosure of an integrated circuit package is detected by the steps of: filling the enclosure with a first gas at the time the enclosure is sealed; subsequently enveloping the integrated circuit package with a second gas that is different than the first gas; holding the second gas at a constant pressure over a certain time period; and sensing a surface of the enclosure, during the above steps, for the presence of microscopic deflections. If the enclosure has a gross leak, no deflection will occur when the package is initially enveloped with the second gas. If the package has a minor leak, a deflection will occur when the package is initially enveloped with the second gas, and the amount of the deflection will decrease during the holding time period. Preferably, the second gas is lighter than the first gas so that it diffuses into the cavity faster than the first gas diffuses out of the cavity; and preferably the microscopic deflections of the enclosure are sensed with a mechanical probe in increments of 0.0001 inches.

Method and apparatus for detecting leaks in IC packages by sensing

A magnetically sealed integrated circuit package includes a substrate having a cavity for holding multiple integrated circuit die, a lid for covering the cavity to protect the die, a ferromagnetic seal ring which is fixed to the substrate around the die, and a magnet which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.

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Escondido, CA, United States of America

Dale L Robinson