Company Filing History:
Years Active: 1996-2014
Title: Dale A Hackitt: Innovator in Microelectronic Packaging
Introduction
Dale A Hackitt is a prominent inventor based in Mesa, AZ (US), known for his contributions to microelectronic packaging. With a total of 6 patents to his name, Hackitt has made significant advancements in the field, particularly in the design and functionality of semiconductor devices.
Latest Patents
Among his latest innovations is the "Ultra slim RF package for ultrabooks and smart phones." This patent describes a semiconductor device package that features a reduced form factor and a method for its formation. In one embodiment, an active die is embedded within a cavity in the core layer of the package substrate, with an in-situ electromagnetic shield formed on the sidewalls of the cavity. Another embodiment includes a crystal oscillator that is partially embedded within the core layer of the package substrate. Additionally, a package with a component embedded in the core layer can be mounted on a PCB, with a crystal oscillator generating a clock frequency for the package also mounted on the PCB. These innovations aim to reduce the x, y, and z dimensions of the package while minimizing electromagnetic noise emitted from the active die.
Another notable patent is the "Microelectronic package having solder-filled through-vias." This invention encompasses an apparatus, method, and system related to microelectronic packaging. In various embodiments, the microelectronic package includes a die with one or more through-vias filled with solder material, a substrate, and solder bumps that electrically connect the substrate to the backside of the die.
Career Highlights
Dale A Hackitt is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic technology. His work has been instrumental in developing innovative solutions that enhance the performance and efficiency of electronic devices.
Collaborations
Throughout his career, Hackitt has collaborated with notable colleagues, including Brian Taggart and Vijay K Nair. These partnerships have fostered a creative environment that has led to groundbreaking advancements in the field of microelectronics.
Conclusion
Dale A Hackitt's contributions to microelectronic packaging have significantly impacted the industry. His innovative patents and collaborative efforts at Intel Corporation highlight his dedication to advancing technology. His work continues to inspire future developments in the field.