Saitama, Japan

Daisuke Tomita

This inventor holds 2 USPTO granted patents. Top assignee: Lintec Corporation. Active years: 2006-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Tomita. Retrieved from https://idiyas.com/inventor/daisuke-tomita-zxgn680v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2006-2011

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2 patents (USPTO):Explore Patents

Title: Innovations by Daisuke Tomita

Introduction

Daisuke Tomita is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of pressure-sensitive adhesive articles, holding a total of 2 patents. His work focuses on enhancing the performance and usability of adhesive materials.

Latest Patents

Tomita's latest patents include a pressure-sensitive adhesive article and a release sheet. The pressure-sensitive adhesive article features a structure where a pressure-sensitive adhesive sheet is laminated on a release sheet. This design ensures that the pressure-sensitive adhesive layer is in contact with a releasing agent layer, which is composed of a material containing substantially no silicone compound. The releasing agent layer is primarily made of an elastomer with a Young's modulus of 1.5 GPa or less, with preferred examples including polybutadiene rubber, polyisoprene rubber, and ethylene propylene rubber. This innovative structure provides excellent releasability and minimal adverse effects on electric components.

The release sheet patent describes a substrate coated with a releasing agent layer, which is cured using ultraviolet rays. This layer is composed of a releasing agent liquid containing 1,4-polybutadiene and an antioxidant. The resulting sheets exhibit excellent releasability from tacky adhesive agent layers while maintaining strong adhesion to the substrate.

Career Highlights

Daisuke Tomita is currently employed at Lintec Corporation, where he continues to develop innovative adhesive solutions. His work has significantly impacted the adhesive industry, particularly in creating non-silicone-based products that enhance performance.

Collaborations

Tomita collaborates with Takuo Nishida, contributing to the advancement of adhesive technologies. Their partnership has led to the development of cutting-edge products that meet the evolving needs of the market.

Conclusion

Daisuke Tomita's contributions to the field of pressure-sensitive adhesives demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of material science and a dedication to improving product performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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