Kanagawa, Japan

Daisuke Nakajima

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Showa Denko Packaging Co., Ltd.. Active years: 2018-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Nakajima. Retrieved from https://idiyas.com/inventor/daisuke-nakajima-r7ree1vh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2018-2023

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3 patents (USPTO):Explore Patents

Title: Innovations by Daisuke Nakajima: Pioneering Packaging Solutions

Introduction

Daisuke Nakajima, an accomplished inventor based in Kanagawa, Japan, has made significant contributions to the field of packaging materials. With a strong portfolio of three patents, Nakajima is dedicated to the advancement of innovative technologies that enhance the functionalities of packaging solutions.

Latest Patents

Recently, Nakajima has developed two notable patents. The first is a shape-forming packaging material that consists of a heat-resistant resin layer as an outer layer, a heat-fusible resin layer as an inner layer, and a metal foil layer sandwiched between the two. This advanced packaging design also features a print-improving resin layer laminated on the outer side of the heat-resistant resin, which enhances visibility and branding.

His second patent concerns a sealant film for packaging materials of power storage devices. This innovative film comprises a laminated structure of two or more layers, including a first resin layer that contains a significant percentage of a random copolymer. This design allows for controlled breakage within the sealant layer when the inner pressure of a power storage device increases excessively, preventing potential bursting of the packaging material.

Career Highlights

Daisuke Nakajima currently works at Showa Denko Packaging Co., Ltd., where he applies his expertise in materials science and engineering to develop cutting-edge packaging technologies. His work focuses on creating solutions that cater to the needs of modern power storage systems and other applications requiring advanced packaging materials.

Collaborations

During his career, Nakajima has collaborated with notable colleagues, including Makoto Karatsu and Takashi Nagaoka. Together, they have contributed to the development of innovative solutions that combine functionality and efficiency in packaging.

Conclusion

Daisuke Nakajima’s inventive spirit and expertise in packaging materials underscore his role as a leader in innovation. His recent patents, particularly in the realms of shape-forming technology and sealing solutions, reflect his commitment to enhancing packaging functionality. As the industry evolves, Nakajima's contributions promise to have a lasting impact on both packaging and power storage solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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