The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Feb. 09, 2018
Applicant:
Showa Denko Packaging Co., Ltd., Kanagawa, JP;
Inventors:
Yuji Minamibori, Kanagawa, JP;
Daisuke Nakajima, Kanagawa, JP;
Assignee:
SHOWA DENKO PACKAGING CO., LTD., Kanagawa, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/124 (2021.01); B32B 7/12 (2006.01); B29C 55/02 (2006.01); B41M 3/00 (2006.01); B32B 15/20 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 37/12 (2006.01); B32B 15/09 (2006.01); B32B 27/36 (2006.01); B32B 27/34 (2006.01); B41M 5/52 (2006.01); B05D 5/04 (2006.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/126 (2021.01); C23C 22/07 (2006.01); B05D 3/02 (2006.01); B29K 623/00 (2006.01); B29K 677/00 (2006.01); B29K 705/02 (2006.01); B29L 31/34 (2006.01); B29L 31/00 (2006.01); B29K 667/00 (2006.01); H01M 10/0525 (2010.01); B41J 2/01 (2006.01); B05D 1/28 (2006.01);
U.S. Cl.
CPC ...
H01M 50/124 (2021.01); B05D 5/04 (2013.01); B29C 55/023 (2013.01); B32B 7/12 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B41M 3/00 (2013.01); B41M 5/52 (2013.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/126 (2021.01); H01M 50/1245 (2021.01); B05D 1/28 (2013.01); B05D 3/0254 (2013.01); B05D 2201/02 (2013.01); B05D 2401/20 (2013.01); B05D 2503/00 (2013.01); B05D 2504/00 (2013.01); B29K 2623/12 (2013.01); B29K 2667/006 (2013.01); B29K 2677/00 (2013.01); B29K 2705/02 (2013.01); B29L 2031/3468 (2013.01); B29L 2031/712 (2013.01); B32B 2250/05 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2307/518 (2013.01); B32B 2457/10 (2013.01); B32B 2553/00 (2013.01); B41J 2/01 (2013.01); B41M 5/5254 (2013.01); B41M 5/5263 (2013.01); C23C 22/07 (2013.01); H01M 10/0525 (2013.01);
Abstract
The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.