Tokyo, Japan

Daisuke Matsude

This inventor holds 1 USPTO granted patent. Top assignee: Asahi Kasei E-Materials Corporation. Active years: 2015.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Daisuke Matsude: Innovator in Glass Cloth Technology

Introduction

Daisuke Matsude is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronics through his innovative work on glass cloth for printed wiring boards. His inventions are characterized by their unique properties that enhance the performance and reliability of electronic components.

Latest Patents

Daisuke Matsude holds a patent for a glass cloth designed specifically for producing printed wiring boards. This invention addresses the need for materials that exhibit minimal anisotropy in dimensional change, ensuring that the boards remain free from warpage and twist. The glass cloth is notable for its specific configuration, which includes warp and weft yarns made from glass yarn with a weight range of 1.8×10 kg/m to 14×10 kg/m. Additionally, the average filament diameter ratio of the weft yarn to the warp yarn is between 1.01 and 1.27, with a thickness ranging from 10 µm to 40 µm.

Career Highlights

Daisuke Matsude is currently associated with Asahi Kasei E-Materials Corporation, where he continues to develop innovative materials for the electronics industry. His work has been instrumental in advancing the technology used in printed wiring boards, which are essential components in various electronic devices.

Collaborations

Daisuke has collaborated with notable colleagues, including Susumu Ohigashi and Masaaki Endo. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the field of materials science.

Conclusion

Daisuke Matsude's contributions to the field of glass cloth technology have made a significant impact on the electronics industry. His innovative patent demonstrates his commitment to enhancing the performance of printed wiring boards, ensuring their reliability in various applications.

Profile summary based on public USPTO records.
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