The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Aug. 25, 2010
Applicants:

Masaaki Endo, Tokyo, JP;

Daisuke Matsude, Tokyo, JP;

Susumu Ohigashi, Tokyo, JP;

Inventors:

Masaaki Endo, Tokyo, JP;

Daisuke Matsude, Tokyo, JP;

Susumu Ohigashi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D03D 15/00 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); D03D 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); C08J 5/24 (2013.01); D03D 1/0082 (2013.01); D03D 15/0011 (2013.01); D03D 15/0094 (2013.01); H05K 2201/029 (2013.01);
Abstract

The present invention provides a glass cloth suitable for producing a printed wiring board to be used in the electronics and electric fields, which has small anisotropy in dimensional change and is free from warpage and twist, a prepreg using said glass cloth, and a printed wiring board using said glass cloth. The glass cloth relevant to the present invention is characterized in that the warp yarn and the weft yarn are configured with a glass yarn of 1.8×10kg/m to 14×10kg/m, a (breadth/length) ratio of an average filament diameter of said weft yarn to an average filament diameter of said warp yarn is 1.01 or more but less than 1.27, and a thickness is 10 μm to 40 μm.


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