Company Filing History:
Years Active: 2020
Title: Daisuke Hironiwa: Innovator in Electronic Component Manufacturing
Introduction
Daisuke Hironiwa is a notable inventor based in Chigasaki, Japan. He has made significant contributions to the field of electronic components through his innovative manufacturing methods. With a focus on enhancing production techniques, Hironiwa has secured a patent that showcases his expertise and creativity.
Latest Patents
Hironiwa holds a patent for a manufacturing method for an electronic component. This method involves several key steps, including the formation of a first metal layer on a substrate, followed by a second metal layer on top of the first. An organic resin layer is then used to create a mask on the second metal layer. The process continues with plasma etching using a fluorine-based reactant gas, which forms a recess in the layered film. Afterward, an oxygen ashing treatment is performed on the recess's inner surface, culminating in the formation of a third metal layer through electroplating.
Career Highlights
Daisuke Hironiwa is currently employed at Ulvac, Inc., where he continues to develop and refine his innovative techniques. His work has positioned him as a key player in the advancement of electronic component manufacturing.
Collaborations
Hironiwa collaborates with talented colleagues, including Takashi Kurimoto and Masahisa Ueda. Their combined expertise fosters a creative environment that drives innovation within their projects.
Conclusion
Daisuke Hironiwa's contributions to electronic component manufacturing highlight his inventive spirit and dedication to advancing technology. His patent reflects a significant step forward in production methods, showcasing the potential for further innovations in the field.