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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10619261 B1

PDFFull Text
Date of Patent:
Apr. 14, 2020

Filed:

Mar. 22, 2018

Manufacturing method for electronic component

Applicant:

Ulvac, Inc., Chigasaki-shi, Kanagawa, JP;

Inventors:

Daisuke Hironiwa, Chigasaki, JP;

Takashi Kurimoto, Chigasaki, JP;

Masahisa Ueda, Chigasaki, JP;

Assignee:

ULVAC, INC., Chigasaki-shi, Kanagawa, JP;

Attorney:

Saliwanchik, Lloyd & Eisenschenk

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
C25D 5/34 (2006.01); H01L 21/768 (2006.01); H01L 21/3065 (2006.01); H01L 23/538 (2006.01); H01L 21/3205 (2006.01); H01L 23/522 (2006.01); C23F 4/00 (2006.01); C25D 7/12 (2006.01); C25D 5/02 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
C25D 5/34 (2013.01); C23F 4/00 (2013.01); C25D 5/022 (2013.01); C25D 7/12 (2013.01); H01L 21/3065 (2013.01); H01L 21/3205 (2013.01); H01L 21/768 (2013.01); H01L 21/76802 (2013.01); H01L 21/76826 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01); H01L 23/522 (2013.01); H01L 23/5384 (2013.01); H01L 23/53238 (2013.01);
Abstract

A manufacturing method for an electronic component according to an aspect of the present invention includes: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; forming a mask made of an organic resin layer on the second metal layer; performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer; performing oxygen ashing treatment on an inner surface of the recess portion; and forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment.

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