This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Rohm Gmbh. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Daichi Niwa: Innovator in Semiconductor Technology
Introduction
Daichi Niwa is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances performance and reliability.
Latest Patents
Daichi Niwa holds 1 patent for a semiconductor device. This device includes a substrate, a semiconductor element, a connection pad, a plated layer, a wire, and an encapsulation resin. The substrate features a main surface where the semiconductor element is mounted, which includes a main surface electrode. The connection pad, made of copper, is arranged with respect to the substrate and separated from it, featuring a connection surface. A nickel-plated layer partially covers this connection surface. The wire, formed of aluminum, is bonded to both the main surface electrode and the plated layer. Finally, the encapsulation resin protects the semiconductor element, connection pad, plated layer, and wire.
Career Highlights
Daichi Niwa is currently employed at Rohm GmbH, where he continues to innovate in semiconductor technology. His work at the company has positioned him as a key player in advancing electronic components.
Collaborations
Daichi collaborates with Koshun Saito, another talented professional in the field. Their partnership fosters innovation and drives the development of cutting-edge semiconductor solutions.
Conclusion
Daichi Niwa's contributions to semiconductor technology exemplify his dedication to innovation. His patent and ongoing work at Rohm GmbH highlight his role as a significant inventor in the industry.