Koka, Japan

Dai Ukai

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Kikusui Seisakusho Ltd.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dai Ukai. Retrieved from https://idiyas.com/inventor/dai-ukai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Dai Ukai

Introduction

Dai Ukai is a notable inventor based in Koka, Japan. He has made significant contributions to the field of material production through his innovative methods and technologies. His work has garnered attention for its practical applications in manufacturing processes.

Latest Patents

Dai Ukai holds a patent for a "Method of producing solid material and compression molding machine." This invention provides a comprehensive method for producing solid materials, which includes applying a light coloring substance to specific surfaces, filling a die bore with powdery material, and utilizing compression molding techniques. The process culminates in irradiating the molded product to enhance its color, showcasing a blend of creativity and technical expertise.

Career Highlights

Throughout his career, Dai Ukai has been associated with Kikusui Seisakusho Ltd., where he has contributed to various projects and innovations. His work has not only advanced the company's capabilities but has also set new standards in the industry.

Collaborations

Dai Ukai has collaborated with talented individuals such as Yoshitsugu Oneda and Kunihiko Tsutsui. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Dai Ukai's contributions to the field of material production exemplify the spirit of innovation. His patented methods and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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