The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Jul. 26, 2013
Applicant:
Kikusui Seisakusho Ltd., Kyoto-shi, JP;
Inventors:
Yoshitsugu Oneda, Kyoto, JP;
Kunihiko Tsutsui, Kyoto, JP;
Takao Terai, Koka, JP;
Dai Ukai, Koka, JP;
Toshiya Taniguchi, Koka, JP;
Assignee:
KIKUSUI SEISAKUSHO LTD., Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 41/22 (2006.01); B30B 11/02 (2006.01); B30B 11/08 (2006.01); B30B 11/34 (2006.01); A61K 9/00 (2006.01); A61K 9/20 (2006.01); B29C 43/02 (2006.01); B29C 43/20 (2006.01);
U.S. Cl.
CPC ...
B29C 41/22 (2013.01); A61K 9/0056 (2013.01); A61K 9/2013 (2013.01); A61K 9/2072 (2013.01); A61K 9/2095 (2013.01); B29C 43/02 (2013.01); B29C 43/20 (2013.01); B30B 11/027 (2013.01); B30B 11/08 (2013.01); B30B 11/34 (2013.01);
Abstract
The invention provides a method of producing a solid material, and the method includes: applying a light coloring substance to at least one of an inner surface of a die bore, an upper end surface of a lower punch, and a lower end surface of an upper punch; filling a powdery material in the die bore; compression molding the powdery material filled in the die bore with use of the upper punch and the lower punch; and irradiating with light a molded product obtained by the compression molding to color the molded product.