Kyoto, Japan

Dai Inagi

This inventor holds 1 USPTO granted patent. Top assignee: Screen Holdings Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dai Inagi. Retrieved from https://idiyas.com/inventor/dai-inagi-s9ghfwt5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dai Inagi: Inventor in Substrate Processing

Introduction

Dai Inagi is an inventor based in Kyoto, Japan, associated with Screen Holdings Co., Ltd. His patent work concerns methods and equipment for specifying processing conditions in substrate manufacturing.

Latest Patents

The provided information lists one patent for Inagi: “Processing Condition Specifying Method, Substrate Processing Method, Substrate Product Production Method, Computer Program, Storage Medium, Processing Condition Specifying Device, and Substrate Processing Apparatus.”

The invention describes a method for selecting processing conditions using thickness measurements taken before a substrate is processed. It calculates predicted post-processing thickness information for multiple recipe options, evaluates those predictions according to a prescribed method, and specifies the recipe corresponding to the selected prediction. The patent also covers related substrate-processing methods, production methods, software, storage media, devices, and apparatus.

Career Highlights

Inagi’s listed patent reflects work on using measured substrate thickness and predicted processing outcomes to guide recipe selection. The supplied information identifies Screen Holdings Co., Ltd. as his company and records 1 patent.

Collaborations

The provided data names Tatsuya Shimano and Takashi Ota as Inagi’s coworkers. It does not specify their roles in the patent or describe particular collaborations.

Conclusion

Dai Inagi’s documented invention focuses on selecting substrate-processing recipes through thickness prediction and evaluation, connecting measurement data with manufacturing conditions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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