Processing condition specifying method, substrate processing method, substrate product production method, computer program, storage medium, processing condition specifying device, and substrate processing apparatus

Abstract

A processing condition specifying method that includes Steps S, S, and S. In Step S, a prediction thickness information piece containing prediction values of thicknesses after processing on the substrate W is calculated for each of a plurality of recipe information pieces based on measurement thickness information containing measurement values of thicknesses of the substrate W. In Step S, the prediction thickness information pieces each calculated for a corresponding one of the recipe information pieces are evaluated according to a prescribed evaluation method and a prediction thickness information piece is selected from among the prediction thickness information pieces. In Step S, a recipe information piece corresponding to the selected prediction thickness information piece is specified. The measurement values contained in the measurement thickness information indicate a thickness of the substrate W measured before processing on the substrate W.