Beijing, China

Dai Dong

USPTO Granted Patents = 3 

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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3 patents (USPTO):

Title: Dai Dong - Innovator in Laser Technology

Introduction

Dai Dong is a prominent inventor based in Beijing, China. He has made significant contributions to the field of laser technology, holding three patents that showcase his innovative approach to solving complex problems.

Latest Patents

Dai Dong's latest patents include a laser drilling method and a laser drilling system. The laser drilling method involves a hole-boundary formation step where a pulse laser beam is outputted and scanned across a substrate to create a boundary cutting groove for a preformed hole. This is followed by a material-in-hole heating step, where a CO2 laser beam is aligned with the preformed hole to heat the substrate material for a predetermined period. Finally, the hole formation step cools the substrate material, allowing it to deform and fall off from the substrate being drilled. Another notable patent is for a positioning foot, positioning device, and position correction method, which focuses on the automatic positioning of glass substrates. This invention includes a contact member, an elastic member, and a sensor that work together to ensure precise positioning.

Career Highlights

Dai Dong has worked with notable companies such as BOE Technology Group Co., Ltd. and Hefei Xinsheng Optoelectronics Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in laser technology.

Collaborations

Dai Dong has collaborated with esteemed colleagues, including Sheng Tao and Yang Huang. Their combined expertise has fostered an environment of innovation and creativity in their projects.

Conclusion

Dai Dong is a remarkable inventor whose work in laser technology has led to significant advancements in the field. His patents reflect a deep understanding of the technical challenges and innovative solutions that drive progress in this area.

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