The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Sep. 30, 2014
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Dai Dong, Beijing, CN;

Weigang Gong, Beijing, CN;

Yang Huang, Beijing, CN;

Sheng Tao, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/09 (2006.01); C03B 33/02 (2006.01); B23K 26/03 (2006.01); B23K 26/142 (2014.01); B23K 26/388 (2014.01); B23K 26/70 (2014.01); C03B 33/04 (2006.01); B23K 26/382 (2014.01); B23K 26/40 (2014.01); B23K 26/402 (2014.01); B23K 26/0622 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/091 (2013.01); B23K 26/032 (2013.01); B23K 26/0622 (2015.10); B23K 26/142 (2015.10); B23K 26/388 (2013.01); B23K 26/389 (2015.10); B23K 26/40 (2013.01); B23K 26/402 (2013.01); B23K 26/703 (2015.10); C03B 33/0222 (2013.01); C03B 33/04 (2013.01); B23K 2103/00 (2018.08); B23K 2103/42 (2018.08); B23K 2103/54 (2018.08);
Abstract

The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a COlaser beam, aligning the COlaser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.


Find Patent Forward Citations

Loading…