DaeSup Kim

Title: DaeSup Kim - Innovator in Integrated Circuit Packaging

Introduction

DaeSup Kim is a notable inventor based in SujungGu, South Korea. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique manufacturing method that enhances the efficiency and effectiveness of integrated circuits.

Latest Patents

DaeSup Kim holds a patent for an "Integrated circuit packaging system with chip stacking and method of manufacture thereof." This patent outlines a method that includes providing a first substrate, mounting an integrated circuit structure on it, and coupling a vertical chip to both the first and second substrates. The process culminates in forming a package body that encapsulates the integrated circuit structure, the vertical chip, and a portion of the second substrate. He has 1 patent to his name.

Career Highlights

DaeSup Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing packaging technologies that are crucial for modern electronics.

Collaborations

Throughout his career, DaeSup Kim has collaborated with talented individuals such as YoungJoon Kim and DaeSik Choi. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

DaeSup Kim's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His work continues to influence the industry and pave the way for future advancements.