DaePark Lee

Title: DaePark Lee: Innovator in Semiconductor Technology

Introduction

DaePark Lee is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

DaePark Lee holds a patent for a semiconductor device and method for reducing metal burrs using laser grooving. This invention involves the formation of a semiconductor device using a jig that includes a metal frame, a polymer film, and an adhesive layer. An opening is created through the adhesive layer and polymer film, with a groove formed around the opening. A semiconductor package is placed on the jig over the opening, ensuring that a side surface of the package is adjacent to the groove. A shielding layer is then formed over the semiconductor package and jig, allowing for the removal of the semiconductor package from the jig. This innovative approach addresses critical challenges in semiconductor manufacturing.

Career Highlights

DaePark Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to advance his work in semiconductor technology. His expertise and innovative mindset have positioned him as a valuable asset in the industry.

Collaborations

Throughout his career, DaePark Lee has collaborated with talented individuals such as ChangOh Kim and Jinhee Jung. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

DaePark Lee's contributions to semiconductor technology through his patent demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.