Suwon, South Korea

Dae Ung Park

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dae Ung Park. Retrieved from https://idiyas.com/inventor/dae-ung-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dae Ung Park: Innovator in Semiconductor Packaging Technology

Introduction

Dae Ung Park is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor packaging technology. His innovative work has led to the development of a unique semiconductor package manufacturing apparatus.

Latest Patents

Dae Ung Park holds 1 patent for his invention titled "Semiconductor package manufacturing apparatus and semiconductor package manufacturing method using the same." This patent describes a semiconductor package manufacturing apparatus that includes a pin holder with multiple through holes, a set of ejector pins, and two pin disks designed to adjust the heights of the ejector pins. The apparatus is controlled to select specific ejector pins to protrude, enhancing the efficiency of the manufacturing process.

Career Highlights

Dae Ung Park is currently employed at Samsung Electronics Ltd., a leading company in the electronics industry. His role involves advancing semiconductor technologies, which are crucial for modern electronic devices. His expertise in this area has positioned him as a valuable asset to his team.

Collaborations

Dae Ung Park has collaborated with notable colleagues, including Oh Chul Kwon and Seon Young Kim. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Dae Ung Park's contributions to semiconductor packaging technology exemplify the spirit of innovation. His patent and work at Samsung Electronics Ltd. highlight his commitment to advancing the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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