Semiconductor package manufacturing apparatus and semiconductor package manufacturing method using the same

Abstract

A semiconductor package manufacturing apparatus is provided, which comprises a pin holder including a plurality of through holes, a plurality of ejector pins corresponding to the plurality of through holes, a first pin disk including a first protrusion pattern having a first arrangement configured to adjust heights of the plurality of ejector pins, a second pin disk including a second protrusion pattern having a second arrangement configured to adjust the heights of the plurality of ejector pins, and a controller configured to select at least a portion of the plurality of ejector pins to protrude toward an upper portion of the pin holder by selecting one of the first and second pin disks.