Dae Seok Choi

Title: Dae Seok Choi and His Die-Bonding Invention.

Introduction

Dae Seok Choi is an inventor associated with Chungcheongnam-do, South Korea. His patent work includes technology for picking up semiconductor dies and bonding them in manufacturing equipment.

Latest Patents

The available information lists one patent for Choi: Die Pickup Module and Die Bonding Apparatus Including the Same. The invention describes a wafer stage that supports a wafer whose dies are attached to dicing tape, along with a die ejector that separates a selected die from the tape. A non-contact picker lifts the die without touching its front surface, while a vertical driving unit moves the picker and an inverting driving unit turns the picked-up die over. This design addresses die handling within a die-bonding apparatus. Choi’s listed patent count is 1 patent.

Career Highlights

Choi is associated with Semes Co., Ltd. and Samsung Electronics Co., Ltd. The available information does not specify his roles or employment dates at either company.

Collaborations

Chang B Jeong and Young Gun Park are identified as Choi’s coworkers. The available information does not detail their specific contributions to the patent.

Conclusion

Dae Seok Choi’s listed invention focuses on non-contact die pickup and die inversion, supporting precise handling in semiconductor die-bonding equipment.