Company Filing History:
Years Active: 2011-2014
Title: Innovations of Dae Keun Park: Pioneering Patents in Flip Chip Packaging
Introduction
Dae Keun Park, an accomplished inventor based in Seoul, South Korea, has significantly contributed to the field of semiconductor packaging with his inventive spirit. With a total of six patents to his name, his innovative designs have been shaping the future of electronic components and enhancing their efficiency.
Latest Patents
One of Dae Keun Park's most notable inventions is the "Exposed Die Overmolded Flip Chip Package and Fabrication Method." This patent features a unique design that includes a substrate with a die flip chip mounted on its upper surface. The innovative mold cap fills the space between the die's active surface and the substrate, incorporating sidewalls and an annular surface to facilitate optimal heat transfer. By leaving the inactive surface exposed, the design maximizes heat dissipation while minimizing the overall thickness of the package, thus enhancing performance and reliability in electronic applications.
Career Highlights
Dae Keun Park's work at Amkor Technology, Inc., has positioned him as a leader in semiconductor packaging technology. Through his innovative developments, he has played a key role in advancing packaging techniques that improve efficiency and reduce thermal resistance in flip chip technologies.
Collaborations
Throughout his career, Dae Keun Park has collaborated with notable colleagues, including Robert Francis Darveaux and Michael Barrow. These partnerships have fostered an environment of creativity and technical excellence, leading to significant advancements in the industry.
Conclusion
Dae Keun Park's contributions to the field of semiconductor packaging highlight his importance as an inventor and innovator. With his focus on developing effective solutions like the exposed die overmolded flip chip package, he continues to influence the advancement of technology in electronics, ensuring that heat transfer and packaging efficiency remain at the forefront of innovation.