The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2013
Filed:
Apr. 17, 2013
Amkor Technology, Inc., Chandler, AZ (US);
Robert Francis Darveaux, Higley, AZ (US);
Michael Barrow, Chandler, AZ (US);
Miguel Angel Jimarez, Gilbert, AZ (US);
Jae Dong Kim, Seoul, KR;
Dae Keun Park, Seoul, KR;
Ki Wook Lee, Seoul, KR;
Ju Hoon Yoon, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a apace between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surfaces, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.