This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Da-Shiuan Chiou - Innovator in Chemical Mechanical Polishing
Da-Shiuan Chiou is an inventor based in Taipei City, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP) through his innovative ideas and patent applications. His work focuses on improving the efficiency and effectiveness of substrate planarization processes.
Latest Patent Applications: Da-Shiuan Chiou's notable patent application is titled "APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING." This application describes a CMP tool and methods designed for the planarization of a substrate. The CMP tool features a symmetrical arrangement that balances transfer time and enhances throughput. It comprises multiple polishing stations arranged around a transfer chamber. A substrate transfer robot is positioned within the transfer chamber, allowing for efficient substrate handling. The polishing stations are strategically placed at equal distances from the substrate transfer robot, ensuring uniform transfer times among the stations. Additionally, the polishing and cleaning stations may be located in closed chambers filled with inert gases, such as nitrogen, to prevent metal corrosion on substrate surfaces.
Conclusion: Da-Shiuan Chiou's innovative approach to chemical mechanical polishing demonstrates his commitment to advancing technology in this field. His patent application reflects a thoughtful design aimed at improving substrate processing efficiency.