Da-Kung Lo

Title: Da-Kung Lo: Innovator in Semiconductor Fabrication

Introduction

Da-Kung Lo is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative methods have paved the way for advancements in device fabrication.

Latest Patents

Da-Kung Lo holds a patent for a "Method of fabricating semiconductor device." This patent describes a process where a gate structure is formed on a substrate, followed by the creation of a first spacer at the sidewall of the gate structure. Recesses are then formed in the substrate at both sides of the first spacer. A buffer layer and a doped semiconductor compound layer are subsequently formed in each recess. An extra implantation region is created on the surfaces of each buffer layer and each doped semiconductor compound layer. Finally, source/drain contact regions are established in the substrate at both sides of the gate structure. This innovative method enhances the efficiency and performance of semiconductor devices.

Career Highlights

Da-Kung Lo is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work focuses on developing advanced fabrication techniques that improve the performance of semiconductor devices. With a patent portfolio that includes 1 patent, he continues to contribute to the evolution of semiconductor technology.

Collaborations

Throughout his career, Da-Kung Lo has collaborated with notable colleagues, including Tai-Ju Chen and Tung-Hsing Lee. These collaborations have fostered an environment of innovation and have led to significant advancements in their field.

Conclusion

Da-Kung Lo is a key figure in semiconductor innovation, with a focus on improving fabrication methods. His contributions are vital to the ongoing development of efficient semiconductor devices. His work at United Microelectronics Corporation and his collaborations with esteemed colleagues further highlight his impact on the industry.