D H Moon

Title: D H Moon: Innovator in Integrated Circuit Packaging

Introduction

D H Moon is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on innovative methods that enhance the functionality and reliability of plastic integrated circuit devices.

Latest Patents

D H Moon's latest patents include methods for molding a leadframe in plastic integrated circuit devices. These patents detail a package that comprises a die, a die pad, leads, bond wires, and an encapsulant. The design features a stepped profile on the lower surfaces of the die pad and leads, achieved through a partial etching process. This etching step ensures that the encapsulant material effectively fills the recessed areas, preventing the die pad and leads from being pulled vertically from the package body. The encapsulation process allows for the lower surfaces of the die pad and leads to remain exposed for external connections. After encapsulation, the die pad and leads are severed from the leadframe, allowing for the production of individual packages, which can be made one at a time or in bulk.

Career Highlights

Throughout his career, D H Moon has worked with prominent companies, including Amkor Technology, Inc. His expertise in integrated circuit packaging has positioned him as a valuable asset in the industry.

Collaborations

D H Moon has collaborated with notable colleagues such as David T Roman and J H Yee. Their combined efforts have contributed to advancements in the field of integrated circuit technology.

Conclusion

D H Moon's innovative work in integrated circuit packaging has led to the development of effective methods that enhance device performance. His contributions continue to influence the industry and pave the way for future advancements.