Cyril M Kindt

Title: **Innovator Spotlight: Cyril M. Kindt**

Introduction:

Cyril M. Kindt, an esteemed inventor based in Sunnyvale, California, has made significant contributions to the field of technology with a total of three patents to his name. His inventive spirit and technical expertise have led to advancements that enhance the efficiency of wafer manufacturing processes.

Latest Patents:

Cyril's latest patents involve a groundbreaking **Load Port Door Assembly with Integrated Wafer Mapper**. This innovative apparatus is designed to determine the presence or absence of wafers within a cassette, enabling optimal management of wafers during manufacturing. The integration of a wafer mapper with a door assembly in a load port interface separates the process environment from the operator environment. This design includes a port cover plate that seals openings in the bulkhead, and a horizontal door panel that allows cassettes of wafers to be placed conveniently. As the door transitions to a vertical position, wafers are efficiently moved to the process side through the bulkhead opening. A moveable trolley, equipped with sensory technology, detects the location of each wafer, providing vital information for subsequent manufacturing operations. The innovative use of a movable air jet further ensures a clear operational environment by removing liquid droplets or particles from the viewing window.

Career Highlights:

Cyril Kindt has worked with respected companies in the industry, including Fortrend Engineering Corporation. His work has emphasized the importance of precision in wafer handling and has positioned him as a notable figure in the innovation landscape.

Collaborations:

Throughout his career, Cyril has collaborated with talented professionals in the field. Notable coworkers include Kenneth Alan Hardy and Eric Meyhofer, who have likely contributed to the successful development of his innovative solutions and patents.

Conclusion:

Cyril M. Kindt stands out as a visionary inventor whose innovative contributions continue to shape the technology landscape, particularly in the area of wafer manufacturing. His work demonstrates a commitment to enhancing operational efficiency and showcases the importance of collaboration in driving technological advancements.