The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2000

Filed:

Nov. 25, 1998
Applicant:
Inventors:

Jeffrey M Gordon, Sunnyvale, CA (US);

Cyril M Kindt, Sunnyvale, CA (US);

Kenneth A Hardy, San Jose, CA (US);

Steven A Bumgardner, San Jose, CA (US);

William E Wegener, Union City, CA (US);

Eric Meyhofer, Palo Alto, CA (US);

Assignee:

Fortrend Engineering Coirporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
25055936 ; 25055933 ; 414937 ;
Abstract

A load port interface (20) receives, opens and closes a wafer carrier (22). A bulkhead (24) carries a changeable mating plate (92) that is pierced by a window (94). Changing the mating plate (92) adapts the load port interface (20) for use with different sizes of carriers(22). A table (32) of the load port interface (20) receives the carrier (22), advances the carrier (22) until it abuts and seals to the bulkhead (24). An end-effector (42), located on an opposite side of the bulkhead (24) from the carrier (22), actuates latch keys (54) to unlatch a door (48) from the carrier (22). The load port interface (20) then moves the unlatched door (48) rectilinearly, first horizontally away from the bulkhead (24) and then vertically downward, to expose semiconductor wafers (48) present within the carrier (22). The end-effector (42) includes sensors (86, 104) for collecting data about wafers (82) within the carrier (22) by detecting edges (118) thereof. This data is analyzed to determine the arrangement of wafers (82) within the carrier (22).

Published as:
WO9928952A2; WO9928952A3; US6013920A;

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