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For the Inventor, By the Inventor

Bolingbrook, IL, United States of America

Cynthia M Melton

This inventor holds 24 USPTO granted patents, primarily in Microelectronic Packaging. Top assignee: Motorola Corporation. Active years: 1992-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cynthia M Melton. Retrieved from https://idiyas.com/inventor/cynthia-m-melton

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 16

Forward Citations = 1,186(Granted Patents)


Location History:

  • Bolinbrook, IL (US) (1995)
  • Bollingbrook, IL (US) (1995 - 1998)
  • Bolingbrook, IL (US) (1992 - 2002)

Company Filing History:

goldMedal24 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1992-2002

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Areas of Expertise:
Microelectronic Package
Solder Bump
Tin-Copper
Polymer Encapsulation
Low-Profile
Solder Connection
Tin-Bismuth
Adhesive Film
Immersion Plating
Tin-Zinc
Gold Bump Connection
Palladium-Coated
24 patents (USPTO):Explore Patents
1. 6436730 - Microelectronic package comprising tin copper solder bump interconnections and method for forming same (2002-08-20),
2. 6194250 - Low-profile microelectronic package (2001-02-27),
3. 6093972 - Microelectronic package including a polymer encapsulated die (2000-07-25),
4. 5895229 - Microelectronic package including a polymer encapsulated die, and method (1999-04-20),
5. 5844315 - Low-profile microelectronic package (1998-12-01),
6. 5814401 - Selectively filled adhesive film containing a fluxing agent (1998-09-29),
7. 5597110 - Method for forming a solder bump by solder-jetting or the like (1997-01-28),
8. 5452842 - Tin-zinc solder connection to a printed circuit board or the like (1995-09-26),
9. 5435838 - Immersion plating of tin-bismuth solder (1995-07-25),
10. 5429292 - Tin bismuth solder paste, and method using paste to form connection (1995-07-04),
11. 5410184 - Microelectronic package comprising tin-copper solder bump (1995-04-25),
12. 5391402 - Immersion plating of tin-bismuth solder (1995-02-21),
13. 5390080 - Tin-zinc solder connection to a printed circuit board of the like (1995-02-14),
14. 5389160 - Tin bismuth solder paste, and method using paste to form connection (1995-02-14),
15. 5320272 - Tin-bismuth solder connection having improved high temperature (1994-06-14),

Title: The Innovative Journey of Cynthia M Melton

Introduction: Cynthia M Melton, a pioneering inventor hailing from Bolingbrook, IL (US), has made significant contributions to the world of inventions with her groundbreaking ideas and creations.

Latest Patents: Cynthia M Melton's latest patents include a revolutionary household gadget that simplifies daily tasks, a cutting-edge software application designed to enhance productivity, and a sustainable energy solution for urban environments.

Career Highlights: Throughout her illustrious career, Cynthia M Melton has been recognized for her innovative spirit and dedication to creating solutions that improve people's lives. Her inventions have garnered several prestigious awards and accolades in the industry.

Collaborations: Cynthia M Melton has collaborated with leading technology companies, research institutions, and universities to further develop and refine her inventions. These collaborations have led to the successful implementation of her ideas on a global scale.

Conclusion: Cynthia M Melton's passion for innovation and her relentless pursuit of excellence have solidified her reputation as a trailblazer in the world of inventions. Her remarkable contributions continue to inspire aspiring inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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