This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Company. Active years: 1991.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1991
Title: The Innovative Mind of Curtis A. Risley
Introduction
Curtis A. Risley is a notable inventor based in Lincoln, MA (US). He has made significant contributions to the field of electronics, particularly in the design of modular housing assemblies for incompatible circuits. His innovative approach has led to the development of a unique solution that enhances the functionality of electronic devices.
Latest Patents
One of Curtis A. Risley's key patents is titled "Modular housing assembly for two incompatible circuits." This invention provides a modular housing assembly designed for two incompatible circuits, such as an RF circuit and a digital circuit, mounted on the same printed circuit board. The housing assembly consists of a base member and a cover member that mesh to form two double-walled compartments, separated by a double conducting wall. The circuit board features at least one bridge that physically and electrically connects the two circuits, allowing for seamless communication between them. Filters are incorporated to eliminate conductive interference, ensuring optimal performance.
Career Highlights
Curtis A. Risley has had a distinguished career, working at Hewlett-Packard Company, where he has been able to apply his inventive skills to real-world applications. His work has contributed to advancements in electronic design and has had a lasting impact on the industry.
Collaborations
Throughout his career, Curtis has collaborated with talented individuals such as Gordon V. Cook and Larry E. Telford. These partnerships have fostered innovation and have led to the successful development of various projects.
Conclusion
Curtis A. Risley's contributions to the field of electronics through his inventive work exemplify the spirit of innovation. His patent for a modular housing assembly showcases his ability to solve complex problems in electronic design. His career at Hewlett-Packard Company and collaborations with esteemed colleagues further highlight his impact on the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
