The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 1991

Filed:

Oct. 24, 1989
Applicant:
Inventors:

Gordon V Cook, Lexington, MA (US);

Curtis A Risley, Lincoln, MA (US);

Larry E Telford, Bedford, MA (US);

Mark S Kotfila, Chelmsford, MA (US);

Dick Stanley, Holliston, MA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361424 ; 174 / ; 174 / ;
Abstract

A modular housing assembly is provided for two incompatible circuits, for example an RF circuit and a digital circuit, mounted on the same printed circuit board. The housing assembly has a base member and a cover member which are meshed to form two double walled compartments separated by a double conducting wall. The circuit board has at least one bridge physically and electrically connecting the two cicuits on the board which bridges pass through corresponding channels in the separating wall and each contain a matrix of plated through holes which operate to extend the wall through the bridge. Interconnecting wiring is woven through the holes to pass desired signals. Filters are provided between the interconnecting wiring and each circuit to eliminate conductive interference. Conductive gaskets are provided at all junctions of the separating wall with a housing member or with a circuit board to further reduce radiation leakage between the circuits.


Find Patent Forward Citations

Loading…