This inventor holds 3 USPTO granted patents. Top assignee: Delco Electronics Corporation. Active years: 1999-2001.
Company Filing History:
Years Active: 1999-2001
Title: Curt A. Erickson: Innovator in Surface Mount Technology
Introduction
Curt A. Erickson is a notable inventor based in Carmel, IN (US), recognized for his contributions to surface mount technology. He holds a total of 3 patents, showcasing his innovative approach to electronic device design and manufacturing.
Latest Patents
One of his latest patents is for a solder bump input/output pad for a surface mount circuit device. This invention focuses on enhancing the attachment of devices, such as flip chips, to conductor patterns using solder bump connections. The design of the input/output pads is tailored to optimize the distribution, shape, and height of the solder bumps, which improves mechanical bonding and stress relief during thermal cycling.
Another significant patent by Erickson is the flip chip solder bump pad. This method involves converting a wire bond pad of a surface-mount integrated circuit (IC) device into a flip chip solder bump pad. The process includes depositing a nickel layer on the exposed portion of the wire bond pad, which protects it from oxidation. This innovation allows for effective flip-chip mounting to substrates, enhancing the overall performance of electronic devices.
Career Highlights
Curt A. Erickson has made substantial contributions to the field of electronics through his work at Delco Electronics Corporation. His expertise in surface mount technology has positioned him as a key figure in the development of advanced electronic components.
Collaborations
Throughout his career, Erickson has collaborated with notable colleagues, including Ralph Edward Cornell and Aparna Vaidyanthan. These partnerships have fostered innovation and contributed to the advancement of technology in the industry.
Conclusion
Curt A. Erickson's work in surface mount technology has significantly impacted the electronics field. His innovative patents and collaborations highlight his dedication to advancing electronic device design and manufacturing.