The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Nov. 24, 1997
Ralph Edward Cornell, Kokomo, IN (US);
Aparna Vaidyanthan, Carmel, IN (US);
Curt A Erickson, Carmel, IN (US);
Delco Electronics Corporation, Kokomo, IN (US);
Abstract
A surface mount circuit device (,), such as a flip chip, of the type which is attached to a conductor pattern (,) with solder bump connections (,). The solder bump connections (,) are formed by reflowing solder on shaped input/output pads (,) on the device (,), with the shape of the pads (,) being tailored to favorably affect optimal distribution, shape and height of the solder bump connections (,) following reflow soldering of the device (,) to the conductor pattern (,). The solder bump connections (,) are preferably characterized by a shape that increases the stand-off height of the device (,). The shaped solder bump connections (,) also promote stress relief during thermal cycling, improve mechanical bonding, allow better penetration of cleaning solutions, and improve flow of encapsulation materials between the device (,) and its substrate (,).