Taipei, Taiwan

Cora Shih Wei Nien

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cora Shih Wei Nien. Retrieved from https://idiyas.com/inventor/cora-shih-wei-nien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Cora Shih Wei Nien: Innovator in Thermal Solutions for Laptops

Introduction

Cora Shih Wei Nien is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the design of thermal solutions for laptops. His innovative approach addresses the challenges of heat management in portable computing devices.

Latest Patents

Cora holds a patent for an "Expandable thermal solution for laptops." This invention features a compartment with a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The design allows for improved heat dissipation by extending the components when needed, ensuring optimal performance during use.

Career Highlights

Cora is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies. His work focuses on enhancing the efficiency and functionality of laptops, making them more user-friendly and effective in various environments.

Collaborations

Cora has collaborated with talented coworkers, including Jeff Ku and Tin Poay Chuah. Their combined expertise contributes to the innovative projects at Intel Corporation.

Conclusion

Cora Shih Wei Nien's contributions to laptop thermal solutions exemplify the importance of innovation in technology. His patent reflects a commitment to improving user experience and device performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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