Connie Tangpuz

Title: The Innovative Contributions of Connie Tangpuz

Introduction

Connie Tangpuz is a notable inventor based in Lapu-Lapu, Philippines. She has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. Her work focuses on enhancing the design and manufacturing processes of semiconductor devices.

Latest Patents

Connie's latest patents include a method to manufacture a universal footprint for a package with an exposed chip. This semiconductor die package features a semiconductor die with a first and second surface, along with a leadframe structure. A molding material is formed around portions of both the die and the leadframe structure, with a solderable layer on the exterior surface of the molding material and the first surface of the semiconductor die. Another significant patent is her flip chip substrate design, which includes a chip device with a leadframe that has a die attach cavity. The memory device incorporates a die placed within this cavity, which is designed to be the same thickness as the die, ensuring a seamless attachment using standard die attachment procedures.

Career Highlights

Connie Tangpuz is currently employed at Fairchild Semiconductor Corporation, where she continues to innovate in semiconductor technology. Her expertise and dedication have made her a valuable asset to her team and the industry.

Collaborations

Some of her notable coworkers include Rajeev Dinkar Joshi and Honorio T Granada, Jr. Their collaborative efforts contribute to the advancement of semiconductor technologies.

Conclusion

Connie Tangpuz's innovative work in semiconductor technology exemplifies her commitment to advancing the field. Her patents reflect her expertise and creativity, making her a prominent figure in the industry.