The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Jan. 13, 2005
Jonathan A. Noquil, Surigao del Sur, PH;
Connie Tangpuz, Lapu-Lapu, PH;
Romel Manatad, Mandaue, PH;
Stephen Martin, South Portland, ME (US);
Rajeev Joshi, Cupertino, CA (US);
Venkat Iyer, Cupertino, CA (US);
Jonathan A. Noquil, Surigao del Sur, PH;
Connie Tangpuz, Lapu-Lapu, PH;
Romel Manatad, Mandaue, PH;
Stephen Martin, South Portland, ME (US);
Rajeev Joshi, Cupertino, CA (US);
Venkat Iyer, Cupertino, CA (US);
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A semiconductor die package is disclosed. It may include a semiconductor die having a first surface and a second surface, and a leadframe structure. A molding material may be formed around at least a portion of the die and at least a portion of the leadframe structure. A solderable layer may be on the exterior surface of the molding material and the first surface of the semiconductor die.